A thermal resistance detection of heteromorphic devices using SiC diode’s temperature-sensitive parameters

Abstract Certain special-shaped devices, such as traveling wave tubes, can be called hollow cylindrical structures in aerospace engineering and other applications. However, the structural complexity of devices means that their heat dissipation characteristics cannot measured directly using conventional techniques. The present work describes a method to measure devices’ thermal resistance by semiconductors’ temperature-sensitive parameters. We prepared special probe collect transient temperature response, differential structure-function curves were obtained processing data method. demonstrate this effectively characterize detect differences caused different processes structures.